Honor Magic V2 Flip Leaks with Customized Ltpo Display Snapdragon 8 Gen 3 Chip Specification More

Honor may soon launch several smartphones in the market. These include names like Honor 400, Honor GT Pro. But at the same time the company is preparing to introduce foldable Honor Magic V4, and Honor Magic V2 Flip. For the first time a leak has emerged regarding the Magic V2 Flip phone. Many important specifications of the phone have been revealed through this leak. For example, this Honor phone will be equipped with a customizable Ltpo display. It can be given Snapdragon 8 Gen 3 chipset. Apart from this, many more special features have been revealed here including Magic V4. Let’s know in detail.

The first leaks about the Honor Magic V2 Flip foldable phone have come out. The company may soon introduce this phone in the market. Tipster Digital chat station In a post on Weibo, its important specifications rivel (via) Are done. The phone may potentially be given a 6.8 -inch customized LTPO display. This phone will be equipped with Qualcomm’s Snapdragon 8 Gen 3 processor.

Talking about Honor Magic V4, this phone will also be equipped with a customized Ltpo display. Its internal display can be 8 inches larger. For security, the phone may have side mounted fingerprint scanner. Snapdragon 8 elite chipset can be seen in Honor Magic V4. Magic V4 can see a 50 -megapixel flagship level camera in the rear side. It will also include telephoto camera. There can be a big change in the design.

According to the tipster, the Magic V4 phone can come more thinner than the old model. Comparing its thickness, the thickness of the Magic V3 phone was 9.2mm in the folded position. In this context, Magic V4 will obviously be introduced with less than 9mm thickness. However, the company has not yet officially given any indication about the specifications mentioned above it. Right now these details are based on only one leak. Soon there is any disclosure from the brand about these smartphones.